Thermal dissipation of DIMM in Tower-BTX configuration

Authors

  • G Petrone
  • G Sorge
  • G Cammarata

DOI:

https://doi.org/10.1260/175095407781421621

Abstract

Natural convection for Dual In-Line Memory Module (DIMM) systems, disposed as predicted by the recent Balanced Technology Extended (BTX) form factor in tower configuration, is numerically studied in this article. The considered physical system is modelled by horizontal air-filled layers bounded by parallel walls in which multiple heat sources are arranged. Three-dimensional simulations are carried-out by using a multi-physical FEM software. The results, obtained for imposed ambient temperature and operative conditions (power supplied to memories), show as thermoconvective instabilities may be produced and consequently complex fluid motion field could be detected. Simulated temperature fields show good agreement with thermal design data proposed by DIMM leading constructors. In order to improve computational performance of the numerical model, a simplified geometry is also proposed and tested for solving the physical problem. The present study contributes in investigation on critical cooling conditions for BTX form factor and in innovative projects of fan-less computer architecture.

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Published

2007-06-30

How to Cite

Petrone, G., Sorge, G. and Cammarata, G. (2007) “Thermal dissipation of DIMM in Tower-BTX configuration”, The International Journal of Multiphysics, 1(2), pp. 231-244. doi: 10.1260/175095407781421621.

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Section

Articles